Excellent capacity of solder-stickiness.
Excellent Anti-wet Capacity.
Widely used on BGA, PGA, CSP packages and flip chip operation.
Suitable for multiple PCB reflow.
No-clean and Lead free for environmental protection.
It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary and helpful tool in BGA reballing.
Nem kaptam választ arra a kérdésemre, hogy lehet lesz-e tovább is rendelni, mert látom, összesen 9 db marat.
I immediately resold it, I hope they will be satisfied, I will use it too, but there is still some left over from the previous one.
I did not receive an answer to my question about whether it is possible to order more, because I can see that there are a total of 9 pieces left.